Tadatomo Suga

Research interests

Publications

• Interfacial Thermal Conductance across Room-Temperature-Bonded GaN/Diamond Interfaces for GaN-on-Diamond Devices

  ACS Applied Materials & Interfaces · 2020 · 10.1021/acsami.9b16959

• High Thermal Boundary Conductance across Bonded Heterogeneous GaN–SiC Interfaces

  ACS Applied Materials & Interfaces · 2019 · 10.1021/acsami.9b10106

• Room temperature GaN-diamond bonding for high-power GaN-on-diamond devices

  Scripta Materialia · 2018 · 10.1016/j.scriptamat.2018.03.016

• Low-Temperature Bonding of Laser Diode Chips on Silicon Substrates Using Plasma Activation of Au Films

  IEEE Photonics Technology Letters · 2007 · 10.1109/lpt.2007.908642

• Bumpless Interconnect Through Ultrafine Cu Electrodes by Means of Surface-Activated Bonding (SAB) Method

  IEEE Transactions on Advanced Packaging · 2006 · 10.1109/tadvp.2006.873138

• Room temperature Cu–Cu direct bonding using surface activated bonding method

  Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2003 · 10.1116/1.1537716

• Self-excited piezoelectric PZT microcantilevers for dynamic SFM—with inherent sensing and actuating capabilities

  Sensors and Actuators A Physical · 1999 · 10.1016/s0924-4247(98)00212-x

• Effect of Surface Roughness on Room-Temperature Wafer Bonding by Ar Beam Surface Activation

  Japanese Journal of Applied Physics · 1998 · https://doi.org/10.1143/jjap.37.4197

• Surface activated bonding of silicon wafers at room temperature

  Applied Physics Letters · 1996 · https://doi.org/10.1063/1.115865

• Structure of AlAl and AlSi3N4 interfaces bonded at room temperature by means of the surface activation method

  Acta Metallurgica et Materialia · 1992 · 10.1016/0956-7151(92)90272-g

Current projects

No projects listed.