Eric Beyne

Researcher Next ID · RN-033712

Researcher · Engineering

Eindhoven, Netherlands

Accepting doctoral researchersFunding unknown

Research interests

Engineering

Materials Science

3D IC and TSV technologies

Electronic Packaging and Soldering Technologies

Semiconductor materials and devices

Additive Manufacturing and 3D Printing Technologies

Copper Interconnects and Reliability

Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology
Journal · 2017 · https://doi.org/10.1109/iedm.2017.8268486
The 3-D Interconnect Technology Landscape
IEEE Design and Test · 2016 · https://doi.org/10.1109/mdat.2016.2544837
Cu pumping in TSVs: Effect of pre-CMP thermal budget
Microelectronics Reliability · 2011 · https://doi.org/10.1016/j.microrel.2011.06.003
Design Issues and Considerations for Low-Cost 3-D TSV IC Technology
IEEE Journal of Solid-State Circuits · 2010 · https://doi.org/10.1109/jssc.2010.2074070
3D stacked IC demonstration using a through Silicon Via First approach
Journal · 2008 · https://doi.org/10.1109/iedm.2008.4796763
3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 μm pitch through-Si vias
Journal · 2006 · https://doi.org/10.1109/iedm.2006.346786
MEMS for wireless communications: from RF-MEMS components to RF-MEMS-SiP
Journal of Micromechanics and Microengineering · 2003 · https://doi.org/10.1088/0960-1317/13/4/323

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