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Kuniyuki Kakushima

Researcher Next ID · RN-035860

Researcher · Engineering

Tokyo Institute of Technology

Tokyo, Japan

Accepting doctoral researchersFunding unknown
Works count
1,244
Citation count
4,183
H-index
32
i10-index
130

Research interests

Engineering
Physics and Astronomy
Social Sciences
Semiconductor materials and devices
Advancements in Semiconductor Devices and Circuit Design
Semiconductor materials and interfaces
Legal and Regulatory Analysis
Linguistic, Cultural, and Literary Studies

Publications

  • Field cycling behavior and breakdown mechanism of ferroelectric Al 0.78 Sc 0.22 N films

    Japanese Journal of Applied Physics · 2022 · 10.35848/1347-4065/ac54f6

  • Room-temperature deposition of a poling-free ferroelectric AlScN film by reactive sputtering

    Applied Physics Letters · 2021 · 10.1063/5.0035335

  • A possible origin of the large leakage current in ferroelectric Al 1− x Sc x N films

    Japanese Journal of Applied Physics · 2021 · 10.35848/1347-4065/abe644

  • GaN‐based complementary metal–oxide–semiconductor inverter with normally off Pch and Nch MOSFETs fabricated using polarisation‐induced holes and electron channels

    IET Power Electronics · 2018 · 10.1049/iet-pel.2017.0376

  • Individual Atomic Imaging of Multiple Dopant Sites in As-Doped Si Using Spectro-Photoelectron Holography

    Nano Letters · 2017 · 10.1021/acs.nanolett.7b03467

  • Multi-layered MoS2 film formed by high-temperature sputtering for enhancement-mode nMOSFETs

    Japanese Journal of Applied Physics · 2015 · 10.7567/jjap.54.04dn08

  • Generation and transportation mechanisms for two-dimensional hole gases in GaN/AlGaN/GaN double heterostructures

    Journal of Applied Physics · 2014 · 10.1063/1.4872242

  • X-ray photoelectron spectroscopy study of high-k CeO2/La2O3 stacked dielectrics

    AIP Advances · 2014 · 10.1063/1.4902017

  • Nonlinear conductance quantization effects in CeOx/SiO2-based resistive switching devices

    Applied Physics Letters · 2012 · 10.1063/1.4733356

  • Resistive switching behavior of a CeO2 based ReRAM cell incorporated with Si buffer layer

    Microelectronics Reliability · 2011 · 10.1016/j.microrel.2011.10.019

  • Interface and electrical properties of La-silicate for direct contact of high-k with silicon

    Solid-State Electronics · 2010 · 10.1016/j.sse.2010.03.005

  • XPS Study of the Bonding Properties of Lanthanum Oxide/Silicon Interface with a Trace Amount of Nitrogen Incorporation

    Journal of The Electrochemical Society · 2009 · 10.1149/1.3268128

  • Origin of flat band voltage shift in HfO2 gate dielectric with La2O3 insertion

    Solid-State Electronics · 2008 · 10.1016/j.sse.2008.04.015

  • Activated boron and its concentration profiles in heavily doped Si studied by soft x-ray photoelectron spectroscopy and Hall measurements

    Journal of Applied Physics · 2008 · 10.1063/1.3014033

  • Suppression of oxygen vacancy formation in Hf-based high-k dielectrics by lanthanum incorporation

    Applied Physics Letters · 2007 · 10.1063/1.2789392

  • DNA Manipulation and Retrieval from an Aqueous Solution with Micromachined Nanotweezers

    Analytical Chemistry · 2003 · 10.1021/ac034501p

Current projects

    No projects listed.