Joungho Kim

Researcher Next ID · RN-036779

Researcher · Engineering

Daejeon, South Korea

Accepting doctoral researchersFunding unknown

Research interests

Engineering

Electromagnetic Compatibility and Noise Suppression

3D IC and TSV technologies

Electronic Packaging and Soldering Technologies

Wireless Power Transfer Systems

Energy Harvesting in Wireless Networks

Coil Design and Measurements of Automotive Magnetic Resonant Wireless Charging System for High-Efficiency and Low Magnetic Field Leakage
IEEE Transactions on Microwave Theory and Techniques · 2016 · https://doi.org/10.1109/tmtt.2015.2513394
Coil Design and Shielding Methods for a Magnetic Resonant Wireless Power Transfer System
Proceedings of the IEEE · 2013 · https://doi.org/10.1109/jproc.2013.2247551
High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)
IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · https://doi.org/10.1109/tcpmt.2010.2101890
Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring
IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · https://doi.org/10.1109/tcpmt.2010.2101892
Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects
IEEE Transactions on Electromagnetic Compatibility · 2010 · https://doi.org/10.1109/temc.2010.2048755
Power distribution networks for system-on-package: status and challenges
IEEE Transactions on Advanced Packaging · 2004 · https://doi.org/10.1109/tadvp.2004.831897

No projects listed.