Chuan Seng Tan

Research interests

Publications

• A review of silicon-based wafer bonding processes, an approach to realize the monolithic integration of Si-CMOS and III–V-on-Si wafers

  Journal of Semiconductors · 2021 · 10.1088/1674-4926/42/2/023106

• High Performance Flexible Visible-Blind Ultraviolet Photodetectors with Two-Dimensional Electron Gas Based on Unconventional Release Strategy

  ACS Nano · 2021 · 10.1021/acsnano.0c10374

• High-efficiency GeSn/Ge multiple-quantum-well photodetectors with photon-trapping microstructures operating at 2 µm

  Optics Express · 2020 · 10.1364/oe.389378

• Condition Monitoring of DC-Link Capacitors Using Goertzel Algorithm for Failure Precursor Parameter and Temperature Estimation

  IEEE Transactions on Power Electronics · 2019 · 10.1109/tpel.2019.2951859

• Online Condition Monitoring System for DC-Link Capacitor in Industrial Power Converters

  IEEE Transactions on Industry Applications · 2018 · 10.1109/tia.2018.2845889

• High-efficiency normal-incidence vertical p-i-n photodetectors on a germanium-on-insulator platform

  Photonics Research · 2017 · 10.1364/prj.5.000702

• Germanium-on-silicon nitride waveguides for mid-infrared integrated photonics

  Applied Physics Letters · 2016 · 10.1063/1.4972183

• Effects of nanowire texturing on the performance of Si/organic hybrid solar cells fabricated with a 2.2 μm thin-film Si absorber

  Applied Physics Letters · 2012 · 10.1063/1.3692590

• Low temperature CuCu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement

  Microelectronics Reliability · 2011 · 10.1016/j.microrel.2011.04.003

• Cu–Cu diffusion bonding enhancement at low temperature by surface passivation using self-assembled monolayer of alkane-thiol

  Applied Physics Letters · 2009 · 10.1063/1.3263154

• Wafer Level 3-D ICs Process Technology

  Integrated circuits and systems · 2008 · 10.1007/978-0-387-76534-1

• Bonding parameters of blanket copper wafer bonding

  Journal of Electronic Materials · 2006 · 10.1007/bf02692440

• Silicon Multilayer Stacking Based on Copper Wafer Bonding

  Electrochemical and Solid-State Letters · 2005 · 10.1149/1.1904506

• Copper bonded layers analysis and effects of copper surface conditions on bonding quality for three-dimensional integration

  Journal of Electronic Materials · 2005 · 10.1007/s11664-005-0151-0

• Contact Resistance Measurement of Bonded Copper Interconnects for Three-Dimensional Integration Technology

  IEEE Electron Device Letters · 2004 · 10.1109/led.2003.821591

• Technology, performance, and computer-aided design of three-dimensional integrated circuits

  Journal · 2004 · 10.1145/981066.981091

• Morphology and Bond Strength of Copper Wafer Bonding

  Electrochemical and Solid-State Letters · 2003 · 10.1149/1.1626994

• Microstructure evolution and abnormal grain growth during copper wafer bonding

  Applied Physics Letters · 2002 · 10.1063/1.1521240

Current projects

No projects listed.