Ken Suzuki

Researcher Next ID · RN-041246

Researcher · Engineering

Amherst Center, Poland

Accepting doctoral researchersFunding unknown

Research interests

Engineering

Materials Science

Copper Interconnects and Reliability

High Temperature Alloys and Creep

Electronic Packaging and Soldering Technologies

Semiconductor materials and devices

Graphene research and applications

The Effect of Chemical Composition and Heat Treatment Conditions on Stacking Fault Energy for Fe-Cr-Ni Austenitic Stainless Steel
Metallurgical and Materials Transactions A · 2013 · https://doi.org/10.1007/s11661-013-1943-0
Thermo-responsive polymer nanoparticles with a core-shell micelle structure as site-specific drug carriers
Journal of Controlled Release · 1997 · https://doi.org/10.1016/s0168-3659(97)00040-0
Reversibly thermo-responsive alkyl-terminated poly(N-isopropylacrylamide) core-shell micellar structures
Colloids and Surfaces B Biointerfaces · 1997 · 10.1016/s0927-7765(97)00015-5
Glucose-Sensing Electrode Coated with Polymer Complex Gel Containing Phenylboronic Acid
Analytical Chemistry · 1996 · 10.1021/ac950748d
Scaling theory for double-gate SOI MOSFET's
IEEE Transactions on Electron Devices · 1993 · https://doi.org/10.1109/16.249482

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