Ming Qin
Researcher Next ID · RN-044541
Researcher · Computer Science
Kunming University of Science and Technology
Kunming, Chile
- Works count
- 359
- Citation count
- 2,793
- H-index
- 25
- i10-index
- 81
Research interests
Publications
Molecular Contrastive Learning with Chemical Element Knowledge Graph
Proceedings of the AAAI Conference on Artificial Intelligence · 2022 · 10.1609/aaai.v36i4.20313
DRIE Trenches and Full-Bridges for Improving Sensitivity of 2-D Micromachined Silicon Thermal Wind Sensor
Journal of Microelectromechanical Systems · 2017 · 10.1109/jmems.2017.2707558
Improved in situ saccharification of cellulose pretreated by dimethyl sulfoxide/ionic liquid using cellulase from a newly isolated Paenibacillus sp. LLZ1
Bioresource Technology · 2015 · 10.1016/j.biortech.2015.11.039
Development of a self-packaged 2D MEMS thermal wind sensor for low power applications
Journal of Micromechanics and Microengineering · 2015 · 10.1088/0960-1317/25/8/085011
2-D Micromachined Thermal Wind Sensors—A Review
IEEE Internet of Things Journal · 2014 · 10.1109/jiot.2014.2319296
Fabrication of a Micromachined Two-Dimensional Wind Sensor by Au–Au Wafer Bonding Technology
Journal of Microelectromechanical Systems · 2012 · 10.1109/jmems.2011.2179014
A Fully Packaged CMOS Interdigital Capacitive Humidity Sensor With Polysilicon Heaters
IEEE Sensors Journal · 2011 · 10.1109/jsen.2011.2154325
Enhanced performance of a CMOS interdigital capacitive humidity sensor by graphene oxide
Journal · 2011 · 10.1109/transducers.2011.5969243
A Cross-Type Thermal Wind Sensor With Self-Testing Function
IEEE Sensors Journal · 2010 · 10.1109/jsen.2009.2034625
A micromachined silicon capacitive temperature sensor for wide temperature range applications
Journal of Micromechanics and Microengineering · 2010 · 10.1088/0960-1317/20/5/055036
Flip-Chip Packaging for a Two-Dimensional Thermal Flow Sensor Using a Copper Pillar Bump Technology
IEEE Sensors Journal · 2007 · 10.1109/jsen.2006.888599
A silicon directly bonded capacitive absolute pressure sensor
Sensors and Actuators A Physical · 2006 · 10.1016/j.sna.2006.09.022
A novel capacitive pressure sensor based on sandwich structures
Journal of Microelectromechanical Systems · 2005 · 10.1109/jmems.2005.859100
Modeling, design and fabrication of a triple-layered capacitive pressure sensor
Sensors and Actuators A Physical · 2004 · 10.1016/j.sna.2004.05.036
A novel capacitive-type humidity sensor using CMOS fabrication technology
Sensors and Actuators B Chemical · 2004 · 10.1016/j.snb.2003.12.060
Single grain thin-film-transistor (TFT) with SOI CMOS performance formed by metal-induced-lateral-crystallization
Journal · 2003 · 10.1109/iedm.1999.824154
Investigation of Polycrystalline Nickel Silicide Films as a Gate Material
Journal of The Electrochemical Society · 2001 · 10.1149/1.1362551
Super thin-film transistor with SOI CMOS performance formed by a novel grain enhancement method
IEEE Transactions on Electron Devices · 2000 · 10.1109/16.853034
A study of nickel silicide film as a mechanical material
Sensors and Actuators A Physical · 2000 · 10.1016/s0924-4247(00)00463-5
Current projects
No projects listed.