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Ming Qin

Researcher Next ID · RN-044541

Researcher · Computer Science

Kunming University of Science and Technology

Kunming, Chile

Accepting doctoral researchersFunding unknown
Works count
359
Citation count
2,793
H-index
25
i10-index
81

Research interests

Computer Science
Engineering
Physics and Astronomy
Advanced MEMS and NEMS Technologies
Advanced Sensor Technologies Research
Mechanical and Optical Resonators
Sensor Technology and Measurement Systems
Advanced Sensor and Energy Harvesting Materials

Publications

  • Molecular Contrastive Learning with Chemical Element Knowledge Graph

    Proceedings of the AAAI Conference on Artificial Intelligence · 2022 · 10.1609/aaai.v36i4.20313

  • DRIE Trenches and Full-Bridges for Improving Sensitivity of 2-D Micromachined Silicon Thermal Wind Sensor

    Journal of Microelectromechanical Systems · 2017 · 10.1109/jmems.2017.2707558

  • Improved in situ saccharification of cellulose pretreated by dimethyl sulfoxide/ionic liquid using cellulase from a newly isolated Paenibacillus sp. LLZ1

    Bioresource Technology · 2015 · 10.1016/j.biortech.2015.11.039

  • Development of a self-packaged 2D MEMS thermal wind sensor for low power applications

    Journal of Micromechanics and Microengineering · 2015 · 10.1088/0960-1317/25/8/085011

  • 2-D Micromachined Thermal Wind Sensors—A Review

    IEEE Internet of Things Journal · 2014 · 10.1109/jiot.2014.2319296

  • Fabrication of a Micromachined Two-Dimensional Wind Sensor by Au–Au Wafer Bonding Technology

    Journal of Microelectromechanical Systems · 2012 · 10.1109/jmems.2011.2179014

  • A Fully Packaged CMOS Interdigital Capacitive Humidity Sensor With Polysilicon Heaters

    IEEE Sensors Journal · 2011 · 10.1109/jsen.2011.2154325

  • Enhanced performance of a CMOS interdigital capacitive humidity sensor by graphene oxide

    Journal · 2011 · 10.1109/transducers.2011.5969243

  • A Cross-Type Thermal Wind Sensor With Self-Testing Function

    IEEE Sensors Journal · 2010 · 10.1109/jsen.2009.2034625

  • A micromachined silicon capacitive temperature sensor for wide temperature range applications

    Journal of Micromechanics and Microengineering · 2010 · 10.1088/0960-1317/20/5/055036

  • Flip-Chip Packaging for a Two-Dimensional Thermal Flow Sensor Using a Copper Pillar Bump Technology

    IEEE Sensors Journal · 2007 · 10.1109/jsen.2006.888599

  • A silicon directly bonded capacitive absolute pressure sensor

    Sensors and Actuators A Physical · 2006 · 10.1016/j.sna.2006.09.022

  • A novel capacitive pressure sensor based on sandwich structures

    Journal of Microelectromechanical Systems · 2005 · 10.1109/jmems.2005.859100

  • Modeling, design and fabrication of a triple-layered capacitive pressure sensor

    Sensors and Actuators A Physical · 2004 · 10.1016/j.sna.2004.05.036

  • A novel capacitive-type humidity sensor using CMOS fabrication technology

    Sensors and Actuators B Chemical · 2004 · 10.1016/j.snb.2003.12.060

  • Single grain thin-film-transistor (TFT) with SOI CMOS performance formed by metal-induced-lateral-crystallization

    Journal · 2003 · 10.1109/iedm.1999.824154

  • Investigation of Polycrystalline Nickel Silicide Films as a Gate Material

    Journal of The Electrochemical Society · 2001 · 10.1149/1.1362551

  • Super thin-film transistor with SOI CMOS performance formed by a novel grain enhancement method

    IEEE Transactions on Electron Devices · 2000 · 10.1109/16.853034

  • A study of nickel silicide film as a mechanical material

    Sensors and Actuators A Physical · 2000 · 10.1016/s0924-4247(00)00463-5

Current projects

    No projects listed.